Tin dipping machine for LED lamp production

Technical Field

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The utility model relates to a wicking machine technical field especially relates to wicking machine is used in production of LED lamp.

Background

The LED lamp is an electroluminescent semiconductor material chip, silver glue or white glue is solidified on the support, then the chip and the circuit board are connected through silver wires or gold wires, the periphery of the chip and the circuit board is sealed through epoxy resin, the effect of protecting an internal core wire is achieved, and finally the shell is installed, so that the anti-seismic performance of the LED lamp is good.

The in-process of LED lamp production need be to circuit board pin wicking, but present wicking machine does not possess drying equipment, can only air-dry naturally behind the pin wicking, so greatly increased processing required time to once can only carry out the wicking operation to a circuit board, the practicality is relatively poor, consequently need design a wicking machine for the production of LED lamp.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a LED lamp production is with wicking machine for solving above-mentioned problem.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

LED lamp production is with wicking machine, including supporting leg, backup pad, melt tin mechanism, wicking mechanism, the supporting leg top is fixed with the backup pad, install the backup pad top melt tin mechanism, it is provided with to melt tin mechanism top the wicking mechanism still includes drying mechanism, drying mechanism installs wicking mechanism top, drying mechanism includes heating cabinet, resistance wire, air-blower, gas-supply pipe, shower nozzle, the heating cabinet internally mounted have the resistance wire, the heating cabinet top is fixed with the air-blower, install the heating cabinet both sides the gas-supply pipe, the gas-supply pipe is kept away from the one end of heating cabinet is fixed with the shower nozzle.

Preferably, the tin melting mechanism comprises a tin melting box, a constant temperature heater, a heat conducting column and a partition plate, the constant temperature heater is fixed inside the tin melting box, the heat conducting column is installed above the constant temperature heater, and the partition plate is installed above the heat conducting column.

Preferably, the wicking mechanism includes support column, roof, electric putter, elevator, spacing seat, places board, standing groove, handle, the quantity of support column is four, four be provided with between the support column electric putter, electric putter's quantity is two, the electric putter below is fixed with the elevator, the elevator side is fixed with spacing seat, two install between the spacing seat place the board, it is provided with on the board to place the standing groove, it is fixed with to place the board top the handle, the support column top is fixed with the roof.

Preferably, the wicking mechanism includes support column, roof, electric putter, elevator, spacing seat, places board, standing groove, projection, disc, the quantity of support column is four, four be provided with between the support column electric putter, electric putter's quantity is two, the electric putter below is fixed with the elevator, the elevator side is fixed with spacing seat, two install between the spacing seat place the board, it is provided with on the board to place the standing groove, it is fixed with to place the board top the projection, the projection top is fixed with the disc, the support column top is fixed with the roof.

Preferably, the partition plate is welded with the tin melting box, and the thickness of the partition plate is 3 cm.

Preferably, the handle is welded with the placing plate, and the handle is made of stainless steel.

Preferably, the disc is welded with the convex column, and the diameter of the convex column is 3 cm.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. by arranging the tin immersion mechanism, tin immersion operation can be carried out on a plurality of circuit boards at one time, so that the practicability of the device is improved;

2. through setting up stoving mechanism, can greatly shorten tin-plating solidification required time, so improved machining efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic view of a first structure of a tin dipping machine for producing LED lamps according to the present invention;

FIG. 2 is a schematic view of a second structure of the wicking machine for producing LED lamps according to the present invention;

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FIG. 3 is a schematic view of a first internal structure of a wicking machine for producing LED lamps according to the present invention;

FIG. 4 is a schematic view of a second internal structure of the wicking machine for producing LED lamps according to the present invention;

FIG. 5 is a schematic structural view of a placing plate in the tin dipping machine for producing LED lamps.

The reference numerals are explained below:

1. supporting legs; 2. a support plate; 3. a tin melting mechanism; 301. a tin melting box; 302. a constant temperature heater; 303. a heat-conducting column; 304. a partition plate; 4. a tin immersion mechanism; 401. a support pillar; 402. a top plate; 403. an electric push rod; 404. a lifting block; 405. a limiting seat; 406. placing the plate; 407. a placement groove; 408. a handle; 409. a convex column; 410. a disc; 5. a drying mechanism; 501. a heating box; 502. a resistance wire; 503. a blower; 504. a gas delivery pipe; 505. and (4) a spray head.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be further explained with reference to the accompanying drawings:

example 1

As shown in fig. 1, fig. 3 and fig. 5, the tin immersion machine is used in the production of LED lamps, including supporting leg 1, supporting plate 2, melt tin mechanism 3, tin immersion mechanism 4, supporting leg 1 top welded fastening has supporting plate 2, 2 tops of supporting plate are installed and are melted tin mechanism 3, it is provided with tin immersion mechanism 4 to melt tin mechanism 3 top, still include drying mechanism 5, drying mechanism 5 installs in tin immersion mechanism 4 top, drying mechanism 5 includes heating cabinet 501, resistance wire 502, air-blower 503, gas-supply pipe 504, shower nozzle 505, heating cabinet 501 internally mounted has resistance wire 502, heating cabinet 501 top is fixed with air-blower 503, heating cabinet 501 both sides welded fastening has gas-supply pipe 504, one end screw thread that heating cabinet 501 was kept away from to gas-supply pipe 504 has shower nozzle 505.

The tin melting mechanism 3 comprises a tin melting box 301, a constant temperature heater 302, a heat conducting column 303 and a partition plate 304, the constant temperature heater 302 is fixed in the tin melting box 301 through screws, the heat conducting column 303 is installed above the constant temperature heater 302, and the partition plate 304 is welded above the heat conducting column 303; the tin immersion mechanism 4 comprises supporting columns 401, a top plate 402, electric push rods 403, lifting blocks 404, limiting seats 405, a placing plate 406, a placing groove 407 and handles 408, the number of the supporting columns 401 is four, the electric push rods 403 are arranged between the four supporting columns 401, the number of the electric push rods 403 is two, the lifting blocks 404 are fixedly welded below the electric push rods 403, the limiting seats 405 are fixedly welded on the side surfaces of the lifting blocks 404, the placing plate 406 is arranged between the two limiting seats 405, the placing groove 407 is arranged on the placing plate 406, the handles 408 are fixedly welded above the placing plate 406, and the top plate 402 is fixedly arranged above the supporting columns 401; the partition plate 304 is welded with the tin melting box 301, and the thickness of the partition plate 304 is 3 cm; the handle 408 is welded to the mounting plate 406, and the handle 408 is made of stainless steel.

In the above structure: when the device is used, the circuit boards are sequentially placed in the placing grooves 407 on the placing plate 406, the placing plate 406 is placed between the two limiting seats 405 by holding the handle 408 after the placing is finished, the electric push rod 403 is started after the placing is finished, the electric push rod 403 extends to drive the lifting block 404 to descend, the lifting block 404 drives the placing plate 406 to descend through the limiting seats 405, when the placing plate 406 descends to a certain height, the electric push rod 403 stops extending, pins of the circuit boards just dip into liquid tin at the moment, the electric push rod 403 is controlled to contract and recover to the original position after a period of time, the resistance wire 502 and the blower 503 are started, the blower 503 conveys outside air to the heating box 501, the resistance wire 502 is electrified to heat the air, the heated air enters the spray head 505 through the air conveying pipe 504, hot air is sprayed out through the spray head 505, and the tin plating on.

Example 2

As shown in fig. 2, 4 and 5, the difference between the embodiment 2 and the embodiment 1 is that the handle 408 is replaced by a convex column 409 and a circular disc 410, the circular disc 410 is welded with the convex column 409, the diameter of the convex column 409 is 3cm, when the device is used, the circuit boards are sequentially placed in the placing grooves 407 on the placing plate 406, and after the placing is finished, the circular disc 410 is held to place the placing plate 406 between the two limiting seats 405, so that the tin immersion operation can be started.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

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Essential Practices for Gold Mitigation of Electronic Components

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Introduction
This paper addresses the critical issue of gold mitigation in electric components. With a focus on the challenges gold poses in electronic assemblies, the paper explores various essential practices to effectively mitigate the use of gold. It discusses the importance of understanding the potential risks associated with gold, such as price fluctuations and environmental concerns, and provides strategies to minimize gold usage while maintaining high-quality performance.

The paper offers valuable insights and guidelines for manufacturers and engineers to navigate the complexities of gold mitigation in electronic component manufacturing and design.

Details
Since gold plating dissolves rapidly during the soldering process, the remaining gold within a solder joint can weaken the integrity of the interconnection. If this gold dissolution is excessive during the solder alloy&#;s liquidus phase formation, the composition and mechanical properties of the resulting solder joint will change.

Gold embrittlement within tin-lead (SnPb) solder joints is a well-known failure mechanism. Commonly used lead-free solder alloys, including tin-silver-copper (SAC305) and tin-nickel-copper (SN100C), are more capable of maintaining their mechanical properties when combined with gold partially due to the greater tin content. However, lead-free solder joints will also degrade with increased gold inclusion.

Gold embrittlement can be a significant reliability issue, with the risk of embrittlement dependent upon several variables, including the amount of gold expected to be leached from the plated surfaces, the volume of the resulting solder joint, and whether the solder is from an infinite source such as a wave or selective soldering process, or reflowed solder paste. In most cases, excessive gold dissolution is from gold-plated component leads rather than the gold contribution from the printed circuit board finish, such as electroless nickel immersion gold (ENIG) or electroless nickel electroless palladium immersion gold (ENIPIG). These board finishes are typically too thin to contribute to gold embrittlement since their average thickness is below the threshold considered a minimal contribution to gold embrittlement.

1. QFN component with gold plated surfaces. Removal of gold plating from component leads is typically performed by a pre-tinning process which removes the gold as it is solubilized in the molten solder during a component re-tinning process. A double tinning process in a static solder pot or single tinning process in a dynamic solder wave should be used for gold removal before soldering the components into a board assembly, as improper removal of gold on component leads and terminations before board-level assembly can potentially result in solder cracks and/or field failures.

Beginning with the IPC J-STD-001 Rev F requirements implemented in and continuing to the current Rev H requirements, it is stated that gold shall be removed from all Class 2 and Class 3 products for the following conditions:

• At least 95% of the surfaces to be soldered of through-hole component leads with 2.54µm or more gold thickness.
• From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness.
• From the surfaces of solder terminals plated with 2.54µm or more gold thickness.

With this criterion, gold removal is required for all high-reliability Class 2 and Class 3 electronic products and affects almost everyone in the electronics manufacturing industry; gold removal is no longer limited solely to aerospace and military applications.

The ideal method to facilitate the removal of gold plating from SMT and through-hole components is to use the robotic hot solder dipping (RHSD) process. It is recommended that this re-tinning operation be carried out using a lead tinning machine using controlled flux application, preheating, single or dual solder pots, nitrogen inerting, and defined process control. A defined process of this type is highly recommended instead of manually dipping components into a standalone static solder pot to reduce solder contamination, minimize non-wetting issues, and enhance solderability.

2. Robotic hot solder dip systems for tinning and gold mitigation. Robotic hot solder dip (RHSD) machines can use single or dual static or dynamic solder pots. When dual static pots are used, the first pot removes gold plating, oxidation, or other residues, and the second pot is used for precise control over solder depth. A nitrogen-inert atmosphere helps the appearance of the resulting solder finish while mitigating icicles and dross buildup. Immersion of the component leads or terminations into the flux and solder should be controlled to allow the flux and solder to flow up the lead or termination to a controlled depth. A defined withdrawal or extraction speed should be used in the second solder pot to control the re-tinning solder thickness and solder pots should be tested regularly for copper, nickel, and other contaminants.

Using a fully programmable robotic hot solder dip (RHSD), machine is highly recommended as opposed to manual solder dipping since these robotic systems precisely control the solder dip depth, dwell times, preheat, and solder temperatures in full compliance with GEIA-STD- standards. The GEIA-STD- standard, Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts, states that robotic solder dipping apparatus shall have:

• Dynamic solder wave or other method to remove oxidation before solder dipping.
• Controlled dwell time in preheat and solder pot within ± 0.1 sec.
• Controlled depth of immersion to within ± 0.1mm.
• Controlled exit speed from solder pot to within ± 0.3 cm/sec.
• Piece parts shall be pre-heated to no less than 71°C before solder dipping.
• Total immersion time shall be less than 5 seconds on each component side.

Robotic hot solder dip tinning services can remove gold plating from through-hole, and SMT component leads or pads to minimize the risk of gold embrittlement as a potential failure mechanism. When these robotic hot solder dip tinning services, it is recommended to also use a batch wash system for post-process cleaning as well as the following procedures:

• Component moisture sensitivity level (MSL) dry bake per J-STD-033.
• Component moisture sensitivity level (MSL) packaging per J-STD-020.
• Tape and reel packaging per EIA-481.
• Tray packaging per JEDEC95.

If available from your robotic hot solder dip tinning service provider, the following testing services are beneficial and recommended to ensure process integrity:

• Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25.
• X-ray fluorescence (XRF) for alloy composition and finish thickness per ASTM B568, JESD 213.
• Solderability testing per J-STD-002.
• Visual inspection per JESD22-B101.

For ultra-high reliability, mission-critical applications such as military, security, defense, and/or aerospace, additional component testing services can be required utilizing the following test protocols:

• Pre and post-processing acoustic microscopy testing (CSAM) per MIL-STD-.
• Destructive physical analysis (DPA) per EIA-595 or EIA-469.
• Hermeticity testing (fine and gross leak) per MIL-STD-883, method , MIL-STD-750 method , MIL-STD-202, method 112.
• Temperature, humidity, and bias testing.
• Parametric testing.

Conclusions
This paper sheds light on the crucial issue of gold mitigation in electric components. The paper highlights the potential environmental and economic benefits of reducing gold usage by emphasizing the significance of gold mitigation in electronics manufacturing. The paper explores various practices and techniques and provides valuable insights into effective strategies for mitigating gold in electronic components.

As the demand for electronics continues to rise, implementing these essential practices promotes sustainability and contributes to the optimization of manufacturing processes and cost reduction. Overall, this paper serves as a comprehensive guide for industry professionals and researchers, paving the way for responsible and efficient gold mitigation practices in the electronics sector.

Several members of the Circuit Technology Center team contributed to this feature story.

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