Generally speaking, the SMT industry knows that the SMT nozzle is a key component of the SMT machine. It is used to pick up and place SMT components. There are many types of SMT nozzles on the market, including steel, ceramics, plastic steel, plastic, aluminum alloy, and iron. According to the shape, there are round holes, square holes, V-shaped, etc., and there are many kinds according to the different sizes.
1. Choose by the nozzle shape of the placement machine:
The nozzle shape has square hole, round hole, V groove, etc. Custom-made pick nozzles generally choose flat suction points according to the shape of the material. Some are made as elongated nozzles, and the grooves that extend the material are used for suction. Some are made into a back shape according to the edge of the material, and some are two-sided. Use a flat surface at the end and build a bridge if the middle is uneven. Some materials are sticky and are not easy to discharge, so some grooves should be made in the nozzle wall or made into rubber heads.
2. Choose by the material of the nozzle of the placement machine:
a. Plastic nozzle: When the surface of the material is uneven or the material is sticky, it is suitable to choose the plastic nozzle, but the life of the plastic pick nozzle is not long. It is recommended to buy more plastic nozzles for spare when ordering the plastic pick nozzle. When the nozzle tip is worn out, you can directly replace the glue nozzle tip yourself.
b. Tungsten steel nozzle: the tungsten steel nozzle is strong and durable, but it is easy to turn white. Friends who are not afraid of trouble, or SMT newcomers can choose the tungsten steel nozzle. If it becomes white, use an oil-based pen to paint, and you can continue to use it.
c. Diamond steel nozzle: sturdy, easy to use, never whitish, but very expensive and not cost-effective.
d. Ceramic nozzle: The ceramic nozzle is never white, but it is brittle and easy to break. Careful use can avoid or reduce the occurrence of breakage.
3. Choose by the size of the nozzle of the placement machine:
For standard materials, the nozzle specifications are basically fixed. For example, materials correspond to CN065 nozzles, materials correspond to CN040 nozzles and so on. When some materials are not big or small, and have strange shapes, the nozzle needs to be customized.
The SMT pick and place nozzles are not only the key part of the placement machine to paste and release the components that are sucked, but also the background when the camera of the optical vision system takes pictures. It mainly uses the suction effect of vacuum to suck the components. Use air blowing to put the components adsorbed on the suction nozzle to the coordinate position of the circuit board.
When the suction nozzle of the pick and place machine sucks components, in order to achieve the ideal situation, it is necessary to ensure that the center of the component, the center of the suction nozzle, and the space center of the obtained image should be coincident, and the adjustment of the optical vision system actually requires compensate the deviation caused by this non-coincidence in actual work.
Different mounting components need different suction nozzles to suck. Almost every pick nozzle will have a reflective background, which is mainly to have a good background when the image is taken, so as to ensure that the target information is accurately highlighted when the image is processed. The SMT nozzles are used as the background when extracting the image. The image contrast of the component is enhanced and more clearly visible.
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This article describes a selection of our most widely used nozzles in Surface Mount Applications.
Our machines are designed to match the Juki type 5xx nozzles, so they are compatible with all types of heads of PPM series Pick and Place Machine. A wide selection of nozzles provide effective placement solutions.There are eight standard 5xx nozzles, ranging from 501 to 508.
NOZZLE SELECTION
Nozzle selection depends on the type and the outer dimensions of the components. The nozzle numbers and the vacuum pressures in the production program data are defined according to the minimum width or diameter D of the components to be picked. When selecting nozzles for non-standard shape components, the nozzle numbers and the vacuum pressures are to be entered manually, in the production program data.
1. Flat Chip
Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type Flat Chip 600 300 300501
Flat Chip
500 200502
Flat Chip
800 300503
Flat Chip
400503
Flat Chip
500504
Flat Chip
500505
Flat Chip
500505
Flat Chip
500505
2. MELFS
Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type MELFΦ
-510
MELF
Φ
-510
MELF
Φ
-510
MELF
Φ
-511
3. Tantalum Capacitors Inductors / Potentiometers
Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type Potentionmeter505
Potentionmeter
506
Potentionmeter
506
Inductor Chip504
Inductor Chip
505
Inductor Ferrite Core
506
Tantalum Capacitor
503
Tantalum Capacitor
504
Tantalum Capacitor
505
4. Electrolytic Capacitors
Component Designation Length(μm) Width(μm) Height(μm) Nozzle TypeElectrolytic Capacitor
Φ
505
Electrolytic Capacitor
Φ
506
Electrolytic Capacitor
Φ
506
Electrolytic Capacitor
Φ
506
Electrolytic Capacitor
Φ
506
Electrolytic Capacitor
Φ
507
Electrolytic Capacitor
Φ
507
Electrolytic Capacitor
Φ
508
5. Transistors / Diodes
Component Designation Length(μm) Width(μm) Height(μm) Nozzle TypeTransistor SC90
800 700503
Transistor SOT323
125
0 900503
Transistor SOT343
503
Transistor SOT353
125
0503
Transistor SOT363
125
0503
Transistor SOT23
13
00 950503
Transistor SOT143
16
00 950504
Transistor SOT25
16
00504
Transistor SOT26
504
Transistor DPAK
506
Diode SOD123504
Diode SOD323
503
6. Small Outlines
Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type SO6 * 1.27p506
SO8 * 1.27p
6
000506
SO14 * 1.27p
6
000506
SO16 * 1.27p
60
00506
SO8L * 1.27p
10
300508
SO14L * 1.27p
0508
SO16L * 1.27p
103
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00508
SO18L * 1.27p
103
00508
SO20L * 1.27p
508
SO24L * 1.27p
508
SO28L * 1.27p
508
SO32L * 1.27p
508
SO40L * 1.27p
508
SOJ24 * 1.27p
507
SOJ26 * 1.27p
507
SOJ28 * 1.27p
507
SOJ32 * 1.27p
507
TSOP24 * 0.5p506
TSOP32 * 0.5p
507
TSOP40 * 0.5p
508
SSOP8 * 0.65p
507
SSOP14* 0.65p
507
SSOP16 * 0.65p
507
SSOP18 * 0.65p
507
SSOP20 * 0.65p
507
SSOP22 * 0.65p
507
SSOP24 * 0.65p
507
SSOP28 * 0.65p
507
SSOP30 * 0.65p
507
SSOP34 * 0.65p
508
SSOP36 * 0.65p
508
SSOP38 * 0.65p
507
SSOP44 * 0.65p
508
SSOP48 * 0.65p
508
SSOP56* 0.65p
508
SSOP64 * 0.65p
508
7. Plastic Leaded Chip Carriers Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type
PLCC20 *1.27p
985
0507
PLCC28 *1.27p
0508
PLCC44 *1.27p
0508
PLCC52 *1.27p
0508
PLCC68 *1.27p
0508
PLCC84 *1.27p
0508
PLCC100 *1.27p
508
PLCC124 *1.27p
0508
8. PLCC Sockets
Component Designation Length(μm) Width(μm) Height(μm) Nozzle TypeSocket PLCC28
0508
Socket PLCC32
0150
0
508
Socket PLCC44
0150
0
508
Socket PLCC52
0150
0
508
Socket PLCC68
0150
0
508
Socket PLCC84
0150
0
508
9. Quad Flat Packs
Component Designation Length(μm) Width(μm) Height(μm) Nozzle Type TQFP32 * 0.8p7
000507
TQFP44 * 0.8p
10
000508
TQFP48 * 0.5p
7
000507
TQFP52 * 0.65p
100
00508
TQFP64 * 0.4p
70
00507
TQFP80 * 0.4p
10
000508
TQFP100 * 0.5p
197
00508
TQFP120 * 0.4p
157
00508
TQFP144 * 0.5p
508
QFP44
* 0.8p
508
QFP52
* 0.65p
508
QFP64 * 0.8p
508
QFP80 * 0.8p
508
QFP100 * 0.65p
508
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